RachelAnne289 Posted January 5, 2022 Report Share Posted January 5, 2022 Hello Everyone, I am looking for considerations to keep in mind while designing a PCB for my worn 3D Printer (Only double-sided available) with high-speed signals (up to 100MHz). But I have some Questions: 4) Would using smds be a better option than through hole components and why? 5) If I use smds, I would have to use vias to provide ground is using vias for ground and also other connections a good option? 6)What other techniques can be used to minimize the stray capacitances and inductances at high frequency. 7)What is with the transmission line termination and control impedance? 8)Microstrip:what is it ? In case of double sided pcb with one ground layer and the other etched part is this microstrip? 9)What should I do with the power should it be provided on the etched side? Please correct me where wrong Please try to answer all it would really help me. Any Idea , Suggestions would be appreciated, I didn’t find the right solution from the internet. Reference:A Completed Tutorial of High-Speed PCB Design Link to comment Share on other sites More sharing options...
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